Exhibitor and partner directory 2025

Welcome to the exhibitor and partner directory of IAA MOBILITY! All about exhibitors, partners, sponsors and products.

POLYN Technology

POLYN Technology

Summit
Co-Exhibitor
 
Practical ultra-low-power solution for real-time tire-road grip monitoring

Company profile

POLYN Technology is a fabless semiconductor company that supplies high-performance Neuromorphic Analog Signal Processing (NASP) technology and application-specific, ultra-low-power Neuromorphic Front End analog chips, ideal for pre-processing raw sensor data. NASP technology and products enable a wide range of thin-edge AI applications with power consumption, accuracy, size, and cloud connectivity constraints.
In the automotive industry, the NASP VibroSense TMS chip enables continuous, real-time monitoring of tire-road grip directly within the tire. Designed to easily integrate and operate with any TPMS node, VibroSense TMS is a practical and affordable ultra-low-power solution supplying AI-processed data from the tire to the vehicle’s ADAS/AD. It can also supply tire wear and rolling resistance data to fleet management applications.
VibroSense TMS is the missing link between the tire and road, providing insight into the tire and surface conditions through analysis of their physical interaction. The AI analysis is made on-device, empowering vehicle OEMs with new insights into tire grip and health, as well as vehicle dynamics, without modifications to existing vehicle hardware.

Main exhibitor

Contact

POLYN Technology
1 HaEshel, 370000 Caesarea, Israel
Contact request
Contact sales
Mr. Serge Kozhanov
Director of Sales
POLYN Technology
Contact PR
Ms. Kaya Sorkin
POLYN Technology

Press releases